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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/170249
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which has excellent chemical resistance and excellent electrical insulation properties, and which enables the achievement of a cured relief pattern that has a forward tapered cross-sectional shape after curing. The present invention is a photosensitive resin composition which contains: an alkali-soluble resin (A) that contains one or more substances selected from among polyimides, precursors of polyimides, polybenzoxazoles and precursors of polybenzoxazoles; and a (meth)acryl group-containing compound (B). The (meth)acryl group-containing compound (B) contains a polyfunctional (meth)acryl group-containing silane condensation product (B1) which is a condensation product of a compound that has a structure represented by general formula (1) and one or more structures selected from among a structure of general formula (2-1), a structure of general formula (2-2) and a structure of general formula (2-3), and which contains a plurality of the structures of general formula (1); and the weight average molecular weight of the compound (B1) is 1,000-20,000. (In general formula (1), R1 represents a hydrogen atom or a methyl group; m represents an integer within the range of 1 ≤ m ≤ 4; and * represents a binding site. In general formulae (2-1), (2-2) and (2-3), R2 represents a methyl group or an ethyl group; n represents an integer within the range of 1 ≤ n ≤ 4; and * represents a binding site.)

Inventors:
KIUCHI YOHEI (JP)
SHOJI YU (JP)
ISOBE KIMIO (JP)
Application Number:
PCT/JP2017/012086
Publication Date:
October 05, 2017
Filing Date:
March 24, 2017
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/075; G03F7/027; G03F7/037; G03F7/20; C08G77/26
Domestic Patent References:
WO2010067685A12010-06-17
Foreign References:
JP2016024319A2016-02-08
JP2008298862A2008-12-11
JP2009288703A2009-12-10
JPH01105242A1989-04-21
JP2007328363A2007-12-20
JP2014048569A2014-03-17
JPH03281616A1991-12-12
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