Title:
PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190810
Kind Code:
A1
Abstract:
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine-containing resin, wherein silica is contained as the (D) inorganic filler, the photosensitive resin film has a first surface and a second surface on the opposite side from the first surface, and the silicon atom concentration at a site having a depth of 1 μm from the first surface is higher than the silicon atom concentration at a site having a depth of 1 μm from the second surface.
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Inventors:
AYUGASE TOMOHIRO (JP)
KONNO YUKO (JP)
YUKIOKA RYO (JP)
KONNO YUKO (JP)
YUKIOKA RYO (JP)
Application Number:
PCT/JP2023/013059
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08G59/42; B32B27/20; C08G18/58; C08G59/17; C08K3/36; C08L27/12; C08L63/10; G03F7/004; G03F7/027; G03F7/032; G03F7/11
Foreign References:
| JP2019179200A | 2019-10-17 | |||
| JPH04185498A | 1992-07-02 | |||
| JP2013195697A | 2013-09-30 | |||
| JPH06148877A | 1994-05-27 | |||
| JP2012081586A | 2012-04-26 | |||
| JPH0927674A | 1997-01-28 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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