Title:
PICK-UP DEVICE, MOUNTING DEVICE, PICK-UP METHOD, AND MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/013333
Kind Code:
A1
Abstract:
The present invention prevents the adhesion of adjacent heat conduction sheets when picking up the heat conduction sheets. The present invention is provided with: a stage 2 on which a heat-conductive molding sheet 20 having a plurality of heat conduction sheets 21 fragmented into small pieces by making a cut is mounted; and a moving head 3 for picking up and moving a heat conduction sheet 21 from the heat conductive molding sheet 20 mounted on the stage 2, wherein the heat conductive molding sheet 20 has magnetic properties, and a holding mechanism 4, which magnetizes and holds at least one among the heat conductive molding sheet 20 and the heat conduction sheets 21, is provided on at least one side of the stage 2 or the moving head 3.
Inventors:
ARAMAKI KEISUKE (JP)
RYOSON HIROYUKI (JP)
BOLOTOV SERGEY (JP)
KUBO YUSUKE (JP)
TOBATA MARINA (JP)
RYOSON HIROYUKI (JP)
BOLOTOV SERGEY (JP)
KUBO YUSUKE (JP)
TOBATA MARINA (JP)
Application Number:
PCT/JP2019/027799
Publication Date:
January 16, 2020
Filing Date:
July 12, 2019
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H05K13/04; H01L23/36; H05K7/20; H05K13/02
Foreign References:
| JP2017175080A | 2017-09-28 | |||
| JP2015139835A | 2015-08-03 | |||
| JP2009123766A | 2009-06-04 | |||
| JP2014069823A | 2014-04-21 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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