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Title:
PICKUP NOZZLE AND COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/049822
Kind Code:
A1
Abstract:
Provided is a pickup nozzle (10) which can pick up and hold two types of components (P1, P2) which have rectangular surfaces to be picked up of differing size, wherein: (A) a pickup surface (50) for contacting the surfaces to be picked up of the components (P1, P2) is formed with dimensions and shape such that the pickup surface (50) would be contained within the dimensions and shape of the surface to be picked up of the larger of the two types of components (P2) and such that the surface to be picked up of the smaller of the two types of components (P1) would be contained within the dimensions and shape of the pickup surface (50); and (B) an opening (62) to the pickup surface (50), for an air hole (60) functioning as a suction path, is formed with dimensions and shape such that the opening (62) would be contained within the dimensions and shape of the surface to be picked up of the smaller of the two types of components (P1). Accordingly, by using this pickup nozzle (10), the number of pickup nozzles required to manufacture one printed circuit board can be reduced, for example.

Inventors:
TESHIMA CHIKASHI (JP)
SAKURAYAMA TAKESHI (JP)
Application Number:
PCT/JP2012/075048
Publication Date:
April 03, 2014
Filing Date:
September 28, 2012
Export Citation:
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Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K13/04
Foreign References:
JPH04176199A1992-06-23
JP2008221437A2008-09-25
JP2010278268A2010-12-09
JP2012204779A2012-10-22
JP2006120914A2006-05-11
JPH04155999A1992-05-28
JPH03206697A1991-09-10
JPH02170498A1990-07-02
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
Central patent business corporation international patent firm (JP)
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