Title:
PIEZOELECTRIC COMPOSITES AND METHODS FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO2004102795
Kind Code:
A3
Abstract:
A method is described for making a composite, such as a piezoelectric composite, having a predetermined volume ratio. Initially, a pair of base slabs are diced to form slot having uniform pitch spacing such that a material portion of one diced base slab may be received within the slots of another diced base slab. The diced base slabs are interdigitated and joined to form a first piezoelectric composite that can subsequently be diced to form slots having a uniform pitch spacing that are spaced from the first slots. Two diced first piezoelectric composites are interdigitated and joined to form a second piezoelectric composite of reduced volume ratio and finer pitch.
Inventors:
YIN JAINHUA
FOSTER FRANCIS STUART
HARASIEWICZ KATARZYNA ANNA
FOSTER FRANCIS STUART
HARASIEWICZ KATARZYNA ANNA
Application Number:
PCT/IB2004/002132
Publication Date:
January 13, 2005
Filing Date:
May 14, 2004
Export Citation:
Assignee:
VISUALSONICS INC (CA)
International Classes:
B06B1/06; H01L41/45; (IPC1-7): H01L41/24; H01L41/18; B06B1/06
Foreign References:
| EP0602261A1 | 1994-06-22 |
Other References:
RUIBIN LIU ET AL: "Interdigital pair bonding for high frequency (20-50 MHz) ultrasonic composite transducers", IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL IEEE USA, vol. 48, no. 1, January 2001 (2001-01-01), pages 299 - 306, XP002304202, ISSN: 0885-3010
LIU RUIBIN ET AL: "2-2 piezoelectric composites with high density and fine scale fabricated by interdigital pair bonding", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 75, no. 21, 22 November 1999 (1999-11-22), pages 3390 - 3392, XP012024129, ISSN: 0003-6951
LIU R ET AL: "Fabrication of 2-2 piezoelectric composites by interdigital pair bonding", 1999 IEEE ULTRASONICS SYMPOSIUM. PROCEEDINGS. INTERNATIONAL SYMPOSIUM (CAT. NO.99CH37027) IEEE PISCATAWAY, NJ, USA, vol. 2, 20 October 1999 (1999-10-20), pages 973 - 976 vol.2, XP002304203, ISBN: 0-7803-5722-1
PATENT ABSTRACTS OF JAPAN vol. 018, no. 263 (E - 1550) 19 May 1994 (1994-05-19)
LIU RUIBIN ET AL: "2-2 piezoelectric composites with high density and fine scale fabricated by interdigital pair bonding", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 75, no. 21, 22 November 1999 (1999-11-22), pages 3390 - 3392, XP012024129, ISSN: 0003-6951
LIU R ET AL: "Fabrication of 2-2 piezoelectric composites by interdigital pair bonding", 1999 IEEE ULTRASONICS SYMPOSIUM. PROCEEDINGS. INTERNATIONAL SYMPOSIUM (CAT. NO.99CH37027) IEEE PISCATAWAY, NJ, USA, vol. 2, 20 October 1999 (1999-10-20), pages 973 - 976 vol.2, XP002304203, ISBN: 0-7803-5722-1
PATENT ABSTRACTS OF JAPAN vol. 018, no. 263 (E - 1550) 19 May 1994 (1994-05-19)
Download PDF:
Previous Patent: MAINTAINING THE DIMENSIONS OF FEATURES BEING ETCHED ON A LITHOGRAPHIC MASK
Next Patent: TWO-PORT SAW RESONATOR
Next Patent: TWO-PORT SAW RESONATOR