Title:
PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/073317
Kind Code:
A1
Abstract:
First and second conducting parts 2, 3 are formed on both main surfaces of a piezoelectric ceramic substrate 1 preferably formed to a very thin 90 μm or less, and the first conducting part 2 has a sintered body 4 comprising a plurality of electroconductive films 2a, 2b having a predetermined pattern. An insulation film 5 is formed, so that a part of the electroconductive films 2a, 2b is exposed, on the main surface of the piezoelectric ceramic substrate 1 on which the electroconductive films 2a, 2b are formed. The insulation film 5 has a ductility equivalent to or higher than that of the electroconductive films 2a, 2b. A piezoelectric device and a method for manufacturing the piezoelectric device, in which occurrence of structural defects such as cracking or delamination is suppressed even when an external force is applied, and an excellent mechanical strength and workability are obtained without a decrease in functionality, are thereby realized.
Inventors:
TANI SHINSUKE (JP)
Application Number:
PCT/JP2016/080203
Publication Date:
May 04, 2017
Filing Date:
October 12, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L41/053; H01L41/083; H01L41/23; H02N2/00
Domestic Patent References:
| WO2006129434A1 | 2006-12-07 |
Foreign References:
| JP2012033866A | 2012-02-16 | |||
| JP2015109627A | 2015-06-11 | |||
| JP2013141330A | 2013-07-18 |
Attorney, Agent or Firm:
KUNIHIRO Yasutoshi (JP)
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