Title:
PIEZOELECTRIC FILM AND LAMINATED PIEZOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/021905
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a piezoelectric film that, when used as a piezoelectric speaker etc., can produce a high sound pressure; and a laminated piezoelectric element in which this piezoelectric film is laminated. The problem is solved by a configuration having: a piezoelectric layer containing piezoelectric particles in a matrix containing a polymer material; an electrode layer provided on both sides of the piezoelectric layer; and a protective layer covering the electrode layer. When the elastic recovery amount is measured by nanoindentation measurement, and it is defined that "elastic recovery amount ratio D = (elastic recovery amount of piezoelectric layer / elastic recovery amount of protective layer)," the elastic recovery amount ratio D satisfies "0.27 ≤ D ≤ 1.19."
Inventors:
TAKEKUMA HIDEAKI (JP)
Application Number:
PCT/JP2022/027994
Publication Date:
February 23, 2023
Filing Date:
July 19, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H04R17/00
Domestic Patent References:
| WO2021157288A1 | 2021-08-12 | |||
| WO2017155006A1 | 2017-09-14 |
Foreign References:
| JP2014212307A | 2014-11-13 | |||
| JP2016032861A | 2016-03-10 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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