PIEZOELECTRIC SENSOR AND HAPTICS DEVICE - BOE TECHNOLOGY GROUP CO LTD

Title:

PIEZOELECTRIC SENSOR AND HAPTICS DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/179219

Kind Code:

A1

Abstract:

Provided in embodiments of the present disclosure are a piezoelectric sensor and a haptics device. The piezoelectric sensor comprises: a base substrate; at least one piezoelectric device located on the base substrate; an organic insulation layer, which is located on a side of the piezoelectric device away from the base substrate and has a first via hole, with the orthographic projection of the first via hole on the base substrate overlapping with the orthographic projection of the piezoelectric device on the base substrate; an inorganic insulation layer, which is located on a side of the organic insulation layer away from the base substrate and at least partially does not overlap with the first via hole; and a wiring layer, which is located on a side of the inorganic insulation layer away from the base substrate and comprises a wire, with one end of the wire being electrically connected to the piezoelectric device by means of at least part of the first via hole.

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Inventors:

CHEN YUJU (CN)

Application Number:

PCT/CN2021/133249

Publication Date:

September 01, 2022

Filing Date:

November 25, 2021

Export Citation:

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Assignee:

BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)

International Classes:

H01L41/08; H01L41/29

Foreign References:

CN107017334A	2017-08-04
CN111769080A	2020-10-13
US20100231657A1	2010-09-16
JP2014197576A	2014-10-16

Other References: