Title:
PLANARIZING FILM MANUFACTURING METHOD, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM
Document Type and Number:
WIPO Patent Application WO/2022/230944
Kind Code:
A1
Abstract:
Provided are: a planarizing film manufacturing method which make it possible to form a planarizing film having excellent production properties and excellent flatness on the uneven surface of a base material having low heat resistance; a planarizing film material; and a planarizing film. The manufacturing method for a planarizing film 2 includes forming, from a planarizing film material and using a PECVD method, a planarizing film 2 on a base material 1 having an uneven surface 11, the planarizing film being for planarizing the uneven surface 11. The planarizing film material contains an organic silane compound, one or more selected from the group consisting of alcohol and water, and an oxidizing agent. The planarizing film 2 is formed by sequentially or simultaneous formation and solidification of an unsolidified film on the base material 1, said film derived from the planarizing film material. The formation and solidification of the unsolidified film are both performed by a chemical reaction excited by plasma.
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Inventors:
CHIBA HIROKAZU (JP)
Application Number:
PCT/JP2022/019120
Publication Date:
November 03, 2022
Filing Date:
April 27, 2022
Export Citation:
Assignee:
TOSOH CORP (JP)
International Classes:
C23C16/42; C09D5/00; C09D7/61; C09D183/04; C23C16/18; C23C16/50; C23C16/56; H01L21/316
Foreign References:
| JPH08111412A | 1996-04-30 | |||
| JP2001148382A | 2001-05-29 | |||
| JP2020520120A | 2020-07-02 | |||
| JPH10242143A | 1998-09-11 | |||
| JP2005294333A | 2005-10-20 | |||
| JP2007318067A | 2007-12-06 |
Attorney, Agent or Firm:
SEKIGUCHI Masao et al. (JP)
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