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Title:
PLASMA DISPLAY PANEL, PLASMA DISPLAY DEVICE, AND PROCESS FOR PRODUCING PLASMA DISPLAY PANEL
Document Type and Number:
WIPO Patent Application WO/2007/108116
Kind Code:
A1
Abstract:
In a plasma display panel, a resin substrate is bonded to at least any one of a front glass substrate and a back glass substrate on its side remote from a discharge space. Since the resin substrate is not exposed to the discharge space, a deterioration in luminescence quality can be prevented. The thickness of the glass substrate can be reduced without lowering the strength by using the resin substrate, and, thus, the weight of the plasma display panel and the plasma display device can be reduced. Consequently, for example, the transport cost can be reduced. For example, the resin substrate may be bonded to a glass substrate after the formation of a principal part of the plasma display panel. In this case, the conventional production process can be utilized. Alternatively, the resin substrate may be bonded to the glass substrate before the formation of a principal part of the plasma display panel. In this case, since the glass substrate is protected by the resin substrate, the glass substrate can easily be handled in the production process.

Inventors:
SASAKI TAKASHI (JP)
KANAE TATSUTOSHI (JP)
YAMANAKA HIROSHI (JP)
SHIMOYOSHI AKIRA (JP)
Application Number:
PCT/JP2006/305735
Publication Date:
September 27, 2007
Filing Date:
March 22, 2006
Export Citation:
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Assignee:
FUJITSU HITACHI PLASMA DISPLAY (JP)
SASAKI TAKASHI (JP)
KANAE TATSUTOSHI (JP)
YAMANAKA HIROSHI (JP)
SHIMOYOSHI AKIRA (JP)
International Classes:
G09F9/00; H01J9/02; H01J11/12; H01J11/34
Foreign References:
JPH1196926A1999-04-09
JPH09259770A1997-10-03
JP2003058064A2003-02-28
JPH11339666A1999-12-10
JP2001028240A2001-01-30
JPH09161683A1997-06-20
JPH09185945A1997-07-15
JPH0737512A1995-02-07
JPH01235125A1989-09-20
JP2003249176A2003-09-05
JP2004117904A2004-04-15
JPH0661020A1994-03-04
Attorney, Agent or Firm:
FURUYA, Fumio et al. (19-5 Nishishinjuku 1-Chom, Shinjuku-ku Tokyo 23, JP)
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