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Patent Searching and Data


Title:
PLASMA PROCESSING METHOD, SEASONING END DETECTION METHOD, AND PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2003/077303
Kind Code:
A1
Abstract:
With conventional analysis data, it is difficult to decide whether the change serving as a judgment reference for a seasoning end is a change caused by the seasoning, i.e., a change based on the state change in a processing vessel or a change based on a temperature change between dummy wafers and to decide whether the seasoning itself is completed. According to the plasma processing method of the present invention, a method for detecting a seasoning end when performing seasoning by supplying a dummy wafer (W) into a processing vessel (2) of a plasma processing device (1) includes a step of supplying a dummy wafer (W) into the processing vessel (2), cooling the interior of the processing vessel (2), and performing multivariate analysis using a plurality of measurement data obtained when a plurality of dummy wafers (W) are supplied again into the processing vessel (2) so as to create a prediction equation for predicting the seasoning end and a step of detecting a seasoning end when performing the seasoning according to the prediction equation.

Inventors:
TAKAYAMA NAOKI (JP)
OH HIN (JP)
HARADA SATOSHI (JP)
Application Number:
PCT/JP2003/002932
Publication Date:
September 18, 2003
Filing Date:
March 12, 2003
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
TAKAYAMA NAOKI (JP)
OH HIN (JP)
HARADA SATOSHI (JP)
International Classes:
H05H1/00; H01L21/00; H01L21/3065; (IPC1-7): H01L21/3065
Foreign References:
JPH1131599A1999-02-02
EP1089146A22001-04-04
JP2002025981A2002-01-25
Attorney, Agent or Firm:
Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
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