Title:
PLASMA TREATMENT DEVICE AND PLASMA TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2023/275938
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology pertaining to a plasma treatment device and a plasma treatment method capable of controlling the density ratio of ions and radicals. The present invention comprises: a treatment chamber in which a sample is plasma-treated; a high-frequency power source which supplies microwave high-frequency electric power for generating plasma inside the treatment chamber; a magnetic field formation mechanism which forms a magnetic field inside the treatment chamber; a sample table which is provided inside the treatment chamber to place a sample thereon; and a shield plate which shields ions being incident on the sample table and is disposed above the sample table, the magnetic field formation mechanism comprising a coil provided on the outer peripheral section of the treatment chamber and a power source connected to the coil. Further, the present invention provides the feature of using the power source of the magnetic field formation mechanism or the high-frequency power source to control the position at which plasma is generated with respect to the shield plate, and plasma is generated while the position for generating plasma is periodically changed vertically with respect to the shield plate.
Inventors:
SONODA YASUSHI (JP)
TANAKA MOTOHIRO (JP)
NAKATANI YUSUKE (JP)
TANAKA MOTOHIRO (JP)
NAKATANI YUSUKE (JP)
Application Number:
PCT/JP2021/024374
Publication Date:
January 05, 2023
Filing Date:
June 28, 2021
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
H01L21/3065
Foreign References:
| JP2018093226A | 2018-06-14 | |||
| JPH04298033A | 1992-10-21 | |||
| JP2004349717A | 2004-12-09 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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