PLASMA TREATMENT DEVICE - HITACHI HIGH TECH CORP

Title:

PLASMA TREATMENT DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/124470

Kind Code:

A1

Abstract:

In order to provide a plasma treatment device capable of achieving stable plasma treatment characteristics, said plasma treatment device has, in a sample stage that is arranged at a lower section in a treatment chamber inside a vacuum container and on which a wafer to be treated by using the plasma is placed, said wafer being placed on an upper surface of a protruding section arranged at an upper center section of the sample stage: an electrode that is arranged inside and that is supplied with high-frequency electrical power while the wafer is being treated, as well as an electrode of a ring-shaped member that is formed of a conductor and that is arranged so as to surround the upper surface at an outer circumferential side of the protruding section of the sample stage; a first ring-shaped cover, formed of a dielectric, that is arranged so as to cover the ring-shaped member between this ring-shaped member and the treatment chamber and between this ring-shaped member and an upper surface of the sample stage; and a second ring-shaped cover, formed of a conductor, that is arranged so as to cover an upper surface of the first ring-shaped cover between the treatment chamber and the upper surface of the first ring-shaped cover. The plasma treatment device is provided with an adjuster that, according to the detection result of the voltage of high-frequency electrical power supplied to the ring-shaped member formed of a conductor while the wafer is being treated, adjusts the magnitude of the high-frequency electrical power.

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Inventors:

KAJIFUSA HIROYUKI (JP)
YOKOGAWA KENETSU (JP)
ARASE TAKAO (JP)
MORI MASAHITO (JP)

Application Number:

PCT/JP2019/049535

Publication Date:

June 24, 2021

Filing Date:

December 18, 2019

Export Citation:

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Assignee:

HITACHI HIGH TECH CORP (JP)

International Classes:

H05H1/46; H01L21/3065

Foreign References:

JP2019192923A	2019-10-31
JP2005303099A	2005-10-27
JP2011108764A	2011-06-02
JP2017055100A	2017-03-16
JP2005064460A	2005-03-10

Attorney, Agent or Firm:

IWASAKI Shigemi (JP)

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