PLATABILITY IMPROVER, MOLDED OBJECT FOR PLATING, PELLET COMPOSITION FOR PLATING, PLATED MOLDED OBJECT, AND PLATING METHOD

Title:

PLATABILITY IMPROVER, MOLDED OBJECT FOR PLATING, PELLET COMPOSITION FOR PLATING, PLATED MOLDED OBJECT, AND PLATING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/009421

Kind Code:

A1

Abstract:

The platability improver of the present invention comprises heterophasic-polymer particles having a coefficient of variation in particle diameter of 40-90%. It is preferable that the proportion of polymer particles each having a particle diameter of 0.05 μm or larger be 80 vol% or greater with respect to all the heterophasic-polymer particles and the proportion of polymer particles each having a particle diameter of 0.05 μm or larger but smaller than 0.15 μm be 10-60 vol% with respect to all the heterophasic-polymer particles.

Inventors:

OONO NORIYOSHI (JP)
TANAKA YUKA (JP)
KITAGUCHI HIRONORI (JP)
WATANABE ATSUSHI (JP)

Application Number:

PCT/JP2018/025775

Publication Date:

January 10, 2019

Filing Date:

July 06, 2018

Export Citation:

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Assignee:

TECHNO UMG CO LTD (JP)

International Classes:

C08F279/04; C08L51/04; C08L101/00; C23C18/16

Foreign References:

JP2011236263A	2011-11-24
JP2010126631A	2010-06-10
JP2002338636A	2002-11-27
JP2007177223A	2007-07-12
JP2002338636A	2002-11-27
JP2007177223A	2007-07-12

Other References: