Title:
PLATE VAPOR CHAMBER ARRAY ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2024/061070
Kind Code:
A1
Abstract:
A plate vapor chamber array assembly with a plurality of plate vapor chambers joined in an array and each chamber having an evaporation area and an evacuated sealed chamber. The plate vapor chambers may be in direct contact with adjacent plate vapor chambers. A vapor chamber clamp surrounding the array has an inner surface engaging an outer edge of at least two of the plate vapor chambers of the array to press a surface of the plate vapor chamber array directly against the heat source.
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| JPS5813990 | HEAT PIPE |
| WO/2022/025252 | HEAT CONDUCTION MEMBER |
| JPS6152587 | MICRO HEAT PIPE |
Inventors:
ZHANG YUE (CN)
Application Number:
PCT/CN2023/118463
Publication Date:
March 28, 2024
Filing Date:
September 13, 2023
Export Citation:
Assignee:
ZHANG YUE (CN)
International Classes:
F28D15/04; H01L23/427
Foreign References:
| US20230020152A1 | 2023-01-19 | |||
| US20190353429A1 | 2019-11-21 | |||
| US20150219401A1 | 2015-08-06 | |||
| CN202452869U | 2012-09-26 | |||
| US6237223B1 | 2001-05-29 | |||
| US20050199376A1 | 2005-09-15 |
Attorney, Agent or Firm:
SHANGHAI SAVVY IP AGENCY CO., LTD. (CN)
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