PLATED RESIN FORMED ARTICLE - DAICEL POLYMER LTD

Title:

PLATED RESIN FORMED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2005/080075

Kind Code:

A1

Abstract:

A plated resin formed article which comprises a thermoplastic resin formed article comprising a composition containing (A) 10 to 90 mass % of a matrix resin exhibiting a water absorption (ISO 62) after the immersion in water at 23°C for 24 hr of 0.6 % or more and (B) 90 to 10 mass % of a resin, except a styrenic resin, exhibiting a water absorption (ISO 62) after the immersion in water at 23°C for 24 hr of less than 0.6 %, and a metal plating layer formed on the surface of the thermoplastic resin formed article, wherein the thermoplastic resin formed article has not been subjected to an etching treatment using an acid containing a heavy metal. The plated resin formed article exhibits high adhesiveness of the plating layer.

Inventors:

TAI TOSHIHIRO
GU WEIHONG
IZUMIYA TATSUO

Application Number:

PCT/JP2005/002827

Publication Date:

September 01, 2005

Filing Date:

February 16, 2005

Export Citation:

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Assignee:

DAICEL POLYMER LTD (JP)
DAICEL CHEM
TAI TOSHIHIRO
GU WEIHONG
IZUMIYA TATSUO

International Classes:

B32B15/08; C08L101/00; C23C18/16; C23C18/24; C23C18/28; (IPC1-7): B32B15/08; C23C18/16

Foreign References:

JPH07330934A	1995-12-19
JPS57123048A	1982-07-31
JPS59142244A	1984-08-15
JP2004002996A	2004-01-08

Other References: