Title:
PLATING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO2002059398
Kind Code:
A3
Abstract:
The present invention relates to a plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus comprises a plating bath containing a plating liquid in which an anode is immersed, a head portion for holding a substrate detachably and bringing a lower surface, to be plated, of the substrate into contact with an overflow surface of the plating liquid held in the plating bath, a drive mechanism for rotating the head portion, and a tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane.
Inventors:
SENDAI SATOSHI (JP)
TOMIOKA KENYA (JP)
TSUDA KATSUMI (JP)
KUMEKAWA MASAYUKI (JP)
MISHIMA KOJI (JP)
TOMIOKA KENYA (JP)
TSUDA KATSUMI (JP)
KUMEKAWA MASAYUKI (JP)
MISHIMA KOJI (JP)
Application Number:
PCT/JP2002/000452
Publication Date:
April 22, 2004
Filing Date:
January 23, 2002
Export Citation:
Assignee:
EBARA CORP (JP)
SENDAI SATOSHI (JP)
TOMIOKA KENYA (JP)
TSUDA KATSUMI (JP)
KUMEKAWA MASAYUKI (JP)
MISHIMA KOJI (JP)
SENDAI SATOSHI (JP)
TOMIOKA KENYA (JP)
TSUDA KATSUMI (JP)
KUMEKAWA MASAYUKI (JP)
MISHIMA KOJI (JP)
International Classes:
C25D5/04; C25D7/12; C25D17/00; C25D21/04; C25D21/10; H01L21/288; H01L21/3205; H01L21/768; H01L23/52; (IPC1-7): C25D7/12; C25D17/00; H01L21/288
Domestic Patent References:
| WO2002058114A1 | 2002-07-25 | |||
| WO1999041434A2 | 1999-08-19 | |||
| WO2000032835A2 | 2000-06-08 |
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