Title:
PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/070234
Kind Code:
A1
Abstract:
Provided is a plating apparatus that suppresses the occurrence of defects in a plated object without the plated object rising excessively to a high position in a plating solution in which the plated object is contained, even if the flow rate of the plating solution sprayed from a spraying unit is increased. The plating apparatus according to the present invention comprises: a plating tank that stores the plating solution and contains the plated object; and the spraying unit, which includes a first spraying port that is formed in the plating tank and sprays the plating solution, the plated object in the plating solution being agitated by the plating solution sprayed from the spraying unit. A mesh member is provided to the first spraying port of the spraying unit. The mesh member is formed by overlapping at least two meshes, and, when viewed in a planar direction, the mesh member includes a center portion and a peripheral portion provided to the outside of the center portion. The peripheral portion is formed using a layer of one mesh or a layer of a plurality of meshes. The center portion is formed in a layer of a plurality of meshes, and the number of layers of the mesh in the center portion is greater than the number of layers of the mesh in the peripheral portion.
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Inventors:
SHIMADA TOMOKAZU (JP)
Application Number:
PCT/JP2023/028659
Publication Date:
April 04, 2024
Filing Date:
August 05, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
C25D17/28; C25D21/10
Domestic Patent References:
| WO2017217216A1 | 2017-12-21 |
Attorney, Agent or Firm:
KAWAMOTO, Takashi (JP)
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