Title:
PLATING DEVICE, AND PLATING DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/079684
Kind Code:
A1
Abstract:
The present invention facilitates maintenance of a component disposed at the bottom of a face-down type plating device. The plating device is equipped with: a plating tank for holding a plating solution; a substrate holder that holds a substrate with a surface to be plated facing downward; a drawer unit that is attached to the plating tank so as to be capable of being freely pulled out in a horizontal direction, and that has an anode disposed so as to face the substrate in the plating tank, and a variable anode mask which has an opening exposing the anode and which is capable of adjusting the opening dimension of the opening.
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Inventors:
TOMITA MASAKI (JP)
Application Number:
PCT/JP2021/040789
Publication Date:
May 11, 2023
Filing Date:
November 05, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D17/00; C25D7/12; C25D17/06; C25D21/00
Foreign References:
| JP2006241599A | 2006-09-14 | |||
| JP2019056164A | 2019-04-11 | |||
| JP6937974B1 | 2021-09-22 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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