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Patent Searching and Data


Title:
POWER CONVERSION DEVICE SUBMODULE
Document Type and Number:
WIPO Patent Application WO/2023/079685
Kind Code:
A1
Abstract:
This power conversion device submodule comprises: IGBTs (11a to 14a, 11b to 14b); drive circuits (40a, 42a, 40b, 42b) for driving the IGBTs (11a to 14a, 11b to 14b); laminated bus bars (22a, 22b) mounted with the IGBTs (11a to 14a, 11b to 14b); substrates (23a, 24a, 23b, 24b) mounted with the drive circuits (40a, 42a, 40b, 42b); a housing frame (55) for housing the IGBTs (11a to 14a, 11b to 14b), the drive circuits (40a, 42a, 40b, 42b), the laminated bus bars (22a, 22b), and the substrates (23a, 24a, 23b, 24b); and separation frames (52a, 52b) for separating a space in which the drive circuits (40a, 42a, 40b, 42b) and the substrates (23a, 24a, 23b, 24b) are disposed from a space in which the IGBTs (11a to 14a, 11b to 14b) and the laminated bus bars (22a, 22b) are disposed.

Inventors:
MIYAZAKI YUKI (JP)
SATO AKIRA (JP)
Application Number:
PCT/JP2021/040791
Publication Date:
May 11, 2023
Filing Date:
November 05, 2021
Export Citation:
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Assignee:
TOSHIBA MITSUBISHI ELECTRIC INDUSTRIAL SYSTEMS CORP (JP)
International Classes:
H02M7/48
Domestic Patent References:
WO2019021532A12019-01-31
WO2019043849A12019-03-07
WO2016203516A12016-12-22
Foreign References:
US20200036137A12020-01-30
JPH10295087A1998-11-04
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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