Title:
PLATING SOLUTION DISPERSION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/046426
Kind Code:
A1
Abstract:
The present invention provides a plating solution dispersion method, relating to the technical field of electroplating. The plating solution dispersion method comprises: when electroplating, intermittently inserting bubbles into a plating solution, and intermittently performing an ultrasonic treatment on the plating solution during the process of intermittently inserting bubbles, wherein at least some of the bubbles are within an ultrasound influence range. The plating solution dispersion method provided by the present invention can not only promote the uniform dispersion of the plating solution, but also ensure the stability of the plating solution during an electroplating process.
Inventors:
XU ZHENGLI (CN)
SHEN QI (CN)
LIN JUANYU (CN)
XIANG YU (CN)
CENG LANG (CN)
SHEN QI (CN)
LIN JUANYU (CN)
XIANG YU (CN)
CENG LANG (CN)
Application Number:
PCT/CN2023/116196
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
WENZHOU TAIYU NEW MATERIAL TECH CO LTD (CN)
International Classes:
C25D21/10
Foreign References:
| CN115305559A | 2022-11-08 | |||
| CN207452279U | 2018-06-05 | |||
| CN107916415A | 2018-04-17 | |||
| CN207672144U | 2018-07-31 | |||
| US20030042145A1 | 2003-03-06 | |||
| CN1612950A | 2005-05-04 | |||
| GB9710700D0 | 1997-07-16 |
Other References:
LIU AILIAN, DAI DONGYAN，XU JIAWEN，CHEN HUI，PANG XIAOLONG: "Microstructure and properties of electroless Ni-P-Graphene composite plating", JOURNAL OF HEILONGJIANG INSTITUTE OF SCIENCE AND TECHNOLOGY, vol. 28, no. 5, 30 September 2018 (2018-09-30), pages 519 - 524, XP093144432, ISSN: 2095-7262
Attorney, Agent or Firm:
BEIJING JOYAN INTELLECTUAL PROPERTY OFFICE et al. (CN)
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