POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS

Title:

POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS

Document Type and Number:

WIPO Patent Application WO2001074958

Kind Code:

A3

Abstract:

Slurries containing SiO2 are used as a polishing agent for planarizing silicon dioxide layers. It was found that slurries have a higher abrasion rate during the polishing of SiO2 layers if the silica sols used have a bimodal particle size distribution.

Inventors:

VOGT KRISTINA (DE)
PANTKE DIETRICH (DE)
PUPPE LOTHAR (DE)
KIRCHMEYER STEPHAN (DE)

Application Number:

PCT/EP2001/003113

Publication Date:

February 28, 2002

Filing Date:

March 19, 2001

Export Citation:

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Assignee:

BAYER AG (DE)
VOGT KRISTINA (DE)
PANTKE DIETRICH (DE)
PUPPE LOTHAR (DE)
KIRCHMEYER STEPHAN (DE)

International Classes:

C09G1/02; C09K3/14; H01L21/304; B24B37/00; H01L21/3105; (IPC1-7): C09G1/02; C09K3/14

Foreign References:

EP0773270A2	1997-05-14
US6043159A	2000-03-28

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