POLISHING BODY, POLISHER, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Title:

POLISHING BODY, POLISHER, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2000/059680

Kind Code:

A1

Abstract:

A hard polishing pad made of a nonfoaming material and used for a CMP machine. In the surface of the polishing pad, a spiral groove or concentric grooves and grid grooves are combinedly made. The angles at which the grooves intersect are two degrees or more. There are no edges having a radius of curvature of 50 $g(m)m or less on the surface. Consequently, no burrs are produced, and the object being polished is not scratched, thereby improving the polishing rate.

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Inventors:

ISHIKAWA AKIRA (JP)
SENGA TATSUYA (JP)
MARUGUCHI SHIROU (JP)
ARAI TAKASHI (JP)
NAKAHIRA HOSEI (JP)
MATSUKAWA EIJI (JP)
MIYAJI AKIRA (JP)

Application Number:

PCT/JP2000/001544

Publication Date:

October 12, 2000

Filing Date:

March 14, 2000

Export Citation:

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Assignee:

NIPPON KOGAKU KK (JP)
ISHIKAWA AKIRA (JP)
SENGA TATSUYA (JP)
MARUGUCHI SHIROU (JP)
ARAI TAKASHI (JP)
NAKAHIRA HOSEI (JP)
MATSUKAWA EIJI (JP)
MIYAJI AKIRA (JP)

International Classes:

B24B37/20; B24B37/26; B24D13/14; (IPC1-7): B24B37/00; H01L21/304

Foreign References:

JPH1148129A	1999-02-23
JPH0752033A	1995-02-28
JPH09150361A	1997-06-10
JPH10118918A	1998-05-12
JPH10125634A	1998-05-15
JP2770721B2	1998-07-02
JPH08132342A	1996-05-28

Other References: