Title:
POLISHING AND BUFFING PAD
Document Type and Number:
WIPO Patent Application WO2005035187
Kind Code:
A3
Abstract:
A buffing and polishing pad or other structure uses extremely fine microfibers of less than 1 denier. Preferred fibers are less than 0.7 denier, and in some cases considerably less. The currently most preferred embodiment is 50% fiber having 0.5 denier and 50% fiber having 0.3 denier. Preferred fibers have an average fiber length of between about 70 and about 90 mm, and most preferably about 80 mm. The fibers can be any suitable material, natural or synthetic, including especially polyester. The fibers are preferably made on a circular knitting machine.
Inventors:
SILVERS GARY M (US)
SEVIGNY CLAUDE (CA)
BERGMAN ROBERT (US)
SEVIGNY CLAUDE (CA)
BERGMAN ROBERT (US)
Application Number:
PCT/US2004/027545
Publication Date:
February 16, 2006
Filing Date:
August 24, 2004
Export Citation:
Assignee:
MEGUIAR S INC (US)
SILVERS GARY M (US)
SEVIGNY CLAUDE (CA)
BERGMAN ROBERT (US)
SILVERS GARY M (US)
SEVIGNY CLAUDE (CA)
BERGMAN ROBERT (US)
International Classes:
A47L11/164; A47L13/16; A47L13/28; B24D13/14; (IPC1-7): D04H1/00; D04B13/00
Foreign References:
| US4426417A | 1984-01-17 | |||
| US5292567A | 1994-03-08 | |||
| US5375289A | 1994-12-27 | |||
| US5935883A | 1999-08-10 | |||
| US5254399A | 1993-10-19 |
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