Title:
POLISHING COMPOSITION AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/046163
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of efficiently reducing surface defects. A polishing composition including a water-soluble polymer (MC-end) is provided as a result of the present invention. The main chain of the water-soluble polymer (MC-end) comprises a non-cationic region as a main constituent region and a cationic region positioned in at least one end of the main chain. The cationic region has at least one cationic group.
Inventors:
TSUCHIYA KOHSUKE (JP)
MORI YOSHIO (JP)
MORI YOSHIO (JP)
Application Number:
PCT/JP2014/075123
Publication Date:
April 02, 2015
Filing Date:
September 22, 2014
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
JP2011103498A | 2011-05-26 | |||
JP2008147688A | 2008-06-26 | |||
JP2009070904A | 2009-04-02 | |||
JP2003303791A | 2003-10-24 | |||
JP2010016344A | 2010-01-21 | |||
JP2010199595A | 2010-09-09 | |||
JP2000345145A | 2000-12-12 | |||
JP2001240850A | 2001-09-04 |
Other References:
MICHAEL M. COLEMAN ET AL.: "Specific Interactions and the Miscibility of Polymer Blend", 1991, TECHNOMIC PUBLISHING CO. INC.
Attorney, Agent or Firm:
ABE MAKOTO (JP)
Makoto Abe (JP)
Makoto Abe (JP)
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