Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/052408
Kind Code:
A1
Abstract:
The present invention provides a polishing composition: that is suitable for polishing objects to be polished having a layer that includes a high-mobility material having a carrier mobility higher than Si; inhibits excessive dissolution of the layer including the high-mobility material; and enables efficient polishing. The present invention is a polishing composition that is used in applications involving polishing objects to be polished having a layer that includes a high-mobility material having a carrier mobility higher than Si, wherein the polishing composition contains abrasive particles and at least one salt compound selected from the group consisting of monovalent acid salts, divalent acid salts, trivalent acid salts, and halide salts. The electrical conductivity of the polishing composition is 1 mS/cm or above, and the content of hydrogen peroxide is less than 0.1 mass%.
Inventors:
TAMADA SHUICHI (JP)
TADA MASAKI (JP)
TADA MASAKI (JP)
Application Number:
PCT/JP2015/077331
Publication Date:
April 07, 2016
Filing Date:
September 28, 2015
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| WO2013157442A1 | 2013-10-24 | |||
| WO2013137192A1 | 2013-09-19 | |||
| WO2002067309A1 | 2002-08-29 |
Foreign References:
| JPH0246729A | 1990-02-16 | |||
| JP2007103463A | 2007-04-19 | |||
| JP3077665B2 | 2000-08-14 | |||
| JP2003220551A | 2003-08-05 | |||
| JP2009218558A | 2009-09-24 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
Hatta international patent business corporation (JP)
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