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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/057155
Kind Code:
A1
Abstract:
[Problem] The objective of the present invention is to provide a polishing composition with which it is possible to polish an article to be polished at higher speeds. [Solution] Provided is a polishing composition used for polishing an article to be polished, wherein the polishing composition contains a dispersion medium and surface-modified abrasive grains in which an ionic dispersant is directly modified on the surface of the abrasive grains, and agglutination of the abrasive grains in the dispersion medium is suppressed.

Inventors:
SATO TSUYOKI (JP)
YOSHIZAKI YUKINOBU (JP)
ONISHI SHOGO (JP)
Application Number:
PCT/JP2016/077905
Publication Date:
April 06, 2017
Filing Date:
September 21, 2016
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
WO2014084091A12014-06-05
Foreign References:
JP2014118490A2014-06-30
JP2012084906A2012-04-26
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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