Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/032715
Kind Code:
A1
Abstract:
Provided is a polishing composition which can achieve both maintenance of a polishing rate and an HLM periphery protrusion elimination ability. This polishing composition contains grains, a basic compound, a salt of a sulfur-containing anion, and water.
Inventors:
TANABE YOSHIYUKI (JP)
ASADA MAKI (JP)
ASADA MAKI (JP)
Application Number:
PCT/JP2022/031390
Publication Date:
March 09, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Foreign References:
| JP2004153158A | 2004-05-27 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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