Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/032714
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of achieving both maintenance of a polishing rate and elimination of bulging of the periphery of a hard laser mark (HLM), the polishing composition comprising abrasive grains, a basic compound, a lithium salt, and water.
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Inventors:
TANABE YOSHIYUKI (JP)
ASADA MAKI (JP)
TSUCHIYA KOHSUKE (JP)
ASADA MAKI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2022/031389
Publication Date:
March 09, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
B24B37/00; H01L21/304; C09G1/02; C09K3/14
Domestic Patent References:
| WO2005090511A1 | 2005-09-29 |
Foreign References:
| JP2002226836A | 2002-08-14 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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