Title:
POLISHING DEVICE AND METHOD FOR DETECTING POLISHING END POINT IN POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/013339
Kind Code:
A1
Abstract:
In the present invention, a polishing end point is detected with high accuracy even if there is a change in polishing frictional force. This polishing device comprises a polishing table for holding a polishing pad, a holding unit for holding an object being polished so as to face the polishing pad, and an end point detection unit for detecting a polishing end point representing the end of polishing of the object being polished by the polishing pad on the basis of a signal indicating the state of the polishing, the end point detection unit eliminating noise in the signal, exponentiating the signal from which the noise was eliminated by using an exponent greater than 1, and detecting the polishing end point on the basis of the exponentiated signal.
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Inventors:
NAKAMURA HIROKI (JP)
SUZUKI YUTA (JP)
WATANABE YUSUKE (JP)
MATSUDA MICHIAKI (JP)
YAMAMOTO KOKI (JP)
TAKAHASHI TARO (JP)
SUZUKI YUTA (JP)
WATANABE YUSUKE (JP)
MATSUDA MICHIAKI (JP)
YAMAMOTO KOKI (JP)
TAKAHASHI TARO (JP)
Application Number:
PCT/JP2022/026550
Publication Date:
February 09, 2023
Filing Date:
July 04, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/013; B24B49/10; B24B49/16; H01L21/304
Domestic Patent References:
| WO2006126420A1 | 2006-11-30 |
Foreign References:
| JP2019098475A | 2019-06-24 | |||
| JP2012124419A | 2012-06-28 | |||
| JP2021091090A | 2021-06-17 | |||
| JP2009059828A | 2009-03-19 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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