Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/074231
Kind Code:
A1
Abstract:
The present invention relates to a polishing device and a polishing method. This polishing device comprises a holding stage (4), a polishing head (14), and a control device (1). The control device (1) comprises a determination unit (1d) that determines the removal of a film (F). The determination unit (1d) decides to remove the film (F) when the rotational torque value is stable at a set torque value.
Inventors:
KODERA KENJI (JP)
Application Number:
PCT/JP2022/036078
Publication Date:
May 04, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B49/16; B24B9/00; B24B21/00; H01L21/304
Foreign References:
| JP2004241434A | 2004-08-26 | |||
| JP2008091951A | 2008-04-17 | |||
| JP2011224680A | 2011-11-10 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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