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Patent Searching and Data


Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/026723
Kind Code:
A1
Abstract:
The present invention relates to a polishing device. The polishing device comprises: a plurality of window members (50) that transmit infrared rays, and a plurality of infrared radiation thermometers (51) that are disposed under the plurality of window members (50), and measure a surface temperature of a substrate (W) held by a polishing head (3).

Inventors:
MATSUO HISANORI (JP)
SUZUKI KEISUKE (JP)
Application Number:
PCT/JP2022/027983
Publication Date:
March 02, 2023
Filing Date:
July 19, 2022
Export Citation:
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Assignee:
EBARA CORP (JP)
KYUSHU INST TECH (JP)
International Classes:
B24B37/26; B24B49/14; B24B55/06; H01L21/304
Foreign References:
JP2020110859A2020-07-27
KR20180055113A2018-05-25
JP2008145133A2008-06-26
JP2001009699A2001-01-16
JP2009224384A2009-10-01
JP2009060044A2009-03-19
JP2004106174A2004-04-08
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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