Title:
POLISHING HEAD AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/166986
Kind Code:
A1
Abstract:
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. A polishing head (10) comprises a pressing member (12) that presses a polishing tape (2) against a substrate (W), an actuator (15) that moves the pressing member (12) in a predetermined pressing direction (CL) and applies a pressing force to the pressing member (12), and a tilt adjusting mechanism (40) that adjusts the tilt of the pressing member (12) with respect to the pressing direction (CL). The tilt adjusting mechanism (40) is configured to tilt the pressing member (12) with respect to the pressing direction (CL) and keep the angle of the tilted pressing member (12).
Inventors:
KASHIWAGI MAKOTO (JP)
FUJISAWA MAO (JP)
FUJISAWA MAO (JP)
Application Number:
PCT/JP2023/005147
Publication Date:
September 07, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/00; B24B21/08; H01L21/304
Foreign References:
| JP2018171698A | 2018-11-08 | |||
| JP2012232358A | 2012-11-29 | |||
| JP2019107752A | 2019-07-04 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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