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Patent Searching and Data


Title:
POLISHING LIQUID AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255582
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing liquid which is less likely to cause dishing on a surface to be polished of an object to be polished after polishing if applied to CMP of an object to be polished having a cobalt-containing film. The present invention also addresses the problem of providing a chemical mechanical polishing method which uses the above-described polishing liquid. A polishing liquid according to the present invention is used in chemical mechanical polishing of an object to be polished having a cobalt-containing film; and this polishing liquid contains colloidal silica, a nitrogen-containing aromatic heterocyclic compound and hydrogen peroxide. At least a specific nitrogen-containing aromatic heterocyclic compound (1) and a specific nitrogen-containing aromatic heterocyclic compound (2), which is different from the nitrogen-containing aromatic heterocyclic compound (1), are contained as the nitrogen-containing aromatic heterocyclic compound.

Inventors:
KAMIMURA Tetsuya (JP)
Application Number:
JP2020/018766
Publication Date:
December 24, 2020
Filing Date:
May 11, 2020
Export Citation:
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Assignee:
FUJIFILM CORPORATION (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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