Title:
POLISHING PAD AND POLISHING METHOD WITH USE OF SAID POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2019/216301
Kind Code:
A1
Abstract:
The present invention relates to a polishing pad which is composed of: a base material; and an adsorption layer and a polishing layer, which are formed on the base material. The adsorption layer is formed of a composition which is obtained by crosslinking at least one silicone that is selected from among a silicone composed of a linear polyorganosiloxane that has vinyl groups only at both ends, and the like. In addition, the present invention is characterized by comprising a ring-like shield member on the adsorption layer, said shield member being arranged along the outer circumference of the polishing pad. This polishing pad is used by having the adsorption layer adsorbed and affixed onto a polishing plate, while supplying a polishing slurry onto the polishing layer during the polishing work. According to the present invention, the ring-like shield member suppresses incursion of the polishing slurry to the interface between the adsorption layer and the polishing plate.
Inventors:
YAJIMA TOSHIYASU (JP)
NINOMIYA DAISUKE (JP)
NINOMIYA DAISUKE (JP)
Application Number:
PCT/JP2019/018209
Publication Date:
November 14, 2019
Filing Date:
May 07, 2019
Export Citation:
Assignee:
MARUISHI SANGYO CO LTD (JP)
International Classes:
B24B37/24; B24B37/22; H01L21/304
Foreign References:
| JP2014108498A | 2014-06-12 | |||
| JP2002036097A | 2002-02-05 | |||
| US20050003738A1 | 2005-01-06 | |||
| JPH11262855A | 1999-09-28 | |||
| JPH08174406A | 1996-07-09 | |||
| JP2013059830A | 2013-04-04 | |||
| JP2010274336A | 2010-12-09 | |||
| JP2001287157A | 2001-10-16 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
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