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Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2023/012940
Kind Code:
A1
Abstract:
Provided is a polishing pad that can stably achieve a required finishing quality of an object to be polished with strict product standards. The polishing pad is formed from a foam body comprising roughly spherical air bubbles, and is characterized in that when the density of a pad constituent material is denoted by DM g/cm3, the density of the polishing pad is in the range of 0.36 to 0.70 DM, the variation (standard deviation σ1) of an opening part diameter based on the air bubbles and formed in the surface of the polishing pad is adjusted to 45 µm or less, the variation (standard deviation σ2) of a diameter, when the area of a portion surrounded by an opening based on the air bubbles and formed in the surface of the polishing pad is circularly approximated, is adjusted to 35 µm or less, and the air bubbles included in the foam body may be closed cell or open cell.

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Inventors:
KINOSHITA OSAMU (JP)
SHOJI KAZUO (JP)
Application Number:
PCT/JP2021/028983
Publication Date:
February 09, 2023
Filing Date:
August 04, 2021
Export Citation:
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Assignee:
UNIVERSAL PHOTONICS FAR EAST INC (JP)
International Classes:
H01L21/304; B24B37/24
Foreign References:
JP2005120253A2005-05-12
JP2018024061A2018-02-15
JP2009214222A2009-09-24
JP2015193060A2015-11-05
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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