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Title:
POLISHING SLURRY COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/121037
Kind Code:
A1
Abstract:
The present invention relates to a polishing slurry composition, and more specifically to a polishing slurry composition for polysilicon polishing, the composition comprising: colloidal silica abrasive particles; a quaternary ammonium cationic monomer; and an acidic material.

Inventors:
CHOI BO HYEOK (KR)
KONG HYUN GOO (KR)
KIM JI HYE (KR)
Application Number:
PCT/KR2022/019314
Publication Date:
June 29, 2023
Filing Date:
December 01, 2022
Export Citation:
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Assignee:
KCTECH CO LTD (KR)
International Classes:
C09G1/02; C09K3/14
Foreign References:
KR20170074466A2017-06-30
KR20180071631A2018-06-28
KR101524624B12015-06-03
KR101349437B12014-01-08
JP2014505358A2014-02-27
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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