Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING SOLUTION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/102019
Kind Code:
A1
Abstract:
Provided is a polishing solution that contains: abrasive grains including a hydroxide of a tetravalent metal element; a monovalent acid component that does not have a carboxyl group; and a non-ionic polymer, said polishing solution having a pH of 4.5 or lower. Also provided is a polishing method comprising a step for polishing a surface to be polished using said polishing solution.

More Like This:
JP2014239228CMP POLISHING LIQUID
JPH11226859RESIN CHIP FOR GRINDING METAL LUMP
WO/2021/162111CMP POLISHING LIQUID AND POLISHING METHOD
Inventors:
IIKURA DAISUKE (JP)
AOKI MASAKO (JP)
Application Number:
PCT/JP2020/042107
Publication Date:
May 19, 2022
Filing Date:
November 11, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
JP2019153678A2019-09-12
JP2019121641A2019-07-22
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: TOPOLOGY INFERRING SYSTEM, PACKET GENERATION DEVICE, TOPOLOGY INFERRING DEVICE, TOPOLOGY INFERRING M...

Next Patent: POLISHING SOLUTION AND POLISHING METHOD