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Title:
POLISHING SOLUTION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/102020
Kind Code:
A1
Abstract:
Provided is a polishing solution that contains: abrasive grains including a hydroxide of a tetravalent metal element; and a nitrogen-containing compound having a hydrocarbon group that has at least six carbon atoms and is bonded to the nitrogen atom, wherein the nitrogen-containing compound includes at least one compound selected from the group consisting of quaternary ammonium salts, tertiary amines, and heterocyclic compounds having a quaternary nitrogen atom that constitutes the heterocycle. Also provided is a polishing method comprising a step for polishing a surface to be polished using said polishing solution.

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Inventors:
IIKURA DAISUKE (JP)
AOKI MASAKO (JP)
Application Number:
PCT/JP2020/042108
Publication Date:
May 19, 2022
Filing Date:
November 11, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
JP2005236275A2005-09-02
JP2011171446A2011-09-01
US20050136673A12005-06-23
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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