Title:
POLYAMIC ACID SOLUTION COMPOSITION AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2017/010566
Kind Code:
A1
Abstract:
The present invention pertains to a polyimide film comprising mainly a polyimide obtained by polymerizing a tetracarboxylic acid component and a diamine component, wherein the tetracarboxylic acid component consists of one or more phthalic anhydride structure-free tetracarboxylic dianhydrides (a1) in which at least one of the bonds connecting the two cyclic acid anhydride structures in the molecule is a freely rotatable bond, and one or more tetracarboxylic dianhydrides (a2) with no freely rotatable bonds in the molecule having an alicyclic structure and the two cyclic acid anhydride structures sharing at least one carbon-carbon bond with an alicyclic structure, and the diamine component includes 5-50 mol% of one or more diamines having a 9,9-diphenylfluorene structure.
Inventors:
NAKAYAMA TOMONORI (JP)
NAKAYAMA TAKESHIGE (JP)
KITAYAMA NAOKI (JP)
NAKAYAMA TAKESHIGE (JP)
KITAYAMA NAOKI (JP)
Application Number:
PCT/JP2016/071011
Publication Date:
January 19, 2017
Filing Date:
July 15, 2016
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
International Classes:
C08G73/10; C08J5/18; H05K1/03
Domestic Patent References:
| WO2013154141A1 | 2013-10-17 | |||
| WO2015080158A1 | 2015-06-04 | |||
| WO2015125895A1 | 2015-08-27 |
Foreign References:
| US5026823A | 1991-06-25 | |||
| JPH11212097A | 1999-08-06 | |||
| JP2016011418A | 2016-01-21 | |||
| JP2015209488A | 2015-11-24 |
Attorney, Agent or Firm:
ITO, Katsuhiro et al. (JP)
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