POLY(AMIC ACID), POLY(AMIC ACID) SOLUTION, POLYIMIDE, POLYIMIDE FILM, LAYERED PRODUCT, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING POLYIMIDE FILM

WIPO Patent Application WO/2022/085620

A1

This poly(amic acid) has a tetravalent organic group represented by general formula (1) as a tetracarboxylic acid dianhydride residue and has one or more residues selected from the group consisting of a p-phenylenediamine residue and a (2-phenyl-4-aminophenyl)-4-aminobenzoate residue as a diamine residue. The content of the tetravalent organic group represented by general formula (1) is 90-100 mol% relative to the total amount of tetracarboxylic acid dianhydride residues. In general formula (1), R1 and R2 are each independently a hydrogen atom, a halogen atom, an alkyl group having 1-12 carbon atoms, an alkenyl group having 2-12 carbon atoms, an alkoxy group having 1-12 carbon atoms, an aryl group having 6-14 carbon atoms, a hydroxyl group, a nitrile group, a nitro group, a carboxyl group, or an amido group.

WO/2022/223182	AN INTERMEDIATE LAYER FOR A SANDWICH PANEL
WO/2020/167929	METHODS FOR MAKING FILMS AND FILMS MADE THEREBY
JP2008183738	RELEASE FILM

SHIRAI YUKI (JP)
NAKAYAMA HIROFUMI (JP)

PCT/JP2021/038394

April 28, 2022

October 18, 2021

Click for automatic bibliography generation  

KANEKA CORP (JP)

B32B27/34; C08G73/10; C08L79/08; H05K1/03

JP2005306983A	2005-11-04
JP2019119779A	2019-07-22
JP2020164597A	2020-10-08
JP6240798B1	2017-11-29
JP2015136868A	2015-07-30
JP2016204457A	2016-12-08
JP6638654B2	2020-01-29
JP2012077285A	2012-04-19

HARUKA PATENT & TRADEMARK ATTORNEYS (JP)

View/Download PDF      PDF Help

Previous Patent: NON-THERMOPLASTIC POLYIMIDE FILM, MULTILAYER POLYIMIDE FILM, AND METAL-CLAD LAMINATED PLATE

Next Patent: HEAD-UP DISPLAY DEVICE