POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE

Title:

POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE

Document Type and Number:

WIPO Patent Application WO/2023/074534

Kind Code:

A1

Abstract:

A polyamic acid varnish according to the present disclosure contains a polyamic acid. The monomers that constitute this polyamic acid include: a monomer (A) that has a C4-12 linear alkylene group but does not have an ester bond, an amide bond, or an ether bond; and a monomer (B) that is a monomer other than the monomer (A). The monomer (A) content is 15 to 70 mol% with respect to the total amount of the monomers that constitute the polyamic acid. The monomer (B) contains at least 90 mol% aromatic monomer.

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Inventors:

TAKASE KO
OKAZAKI MASAKI
TSUKADA YUICHI

Application Number:

PCT/JP2022/039166

Publication Date:

May 04, 2023

Filing Date:

October 20, 2022

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)

International Classes:

C08G73/10; C09J179/08; H05K1/03

Foreign References:

JP2017203980A	2017-11-16
JP2008308551A	2008-12-25
JP2020189935A	2020-11-26