Title:
POLYAMIDE ACID, POLYAMIDE ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074350
Kind Code:
A1
Abstract:
A polyamide acid according to the present invention has a tetracarboxylic acid dianhydride residue and a diamine residue. The tetracarboxylic acid dianhydride residue comprises one or more residues that are selected from the group consisting of a 3,3'4,4'-biphenyl tetracarboxylic acid dianhydride residue, a 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride residue, a 4,4'-oxydiphthalic acid anhydride residue and a spiro[11H-diflo[3,4-b:3',4'-i]xanthene-11,9'-[9H]fluorene]-1,3,7,9-tetrone residue, and a 2,3,6,7-naphthalene tetracarboxylic acid dianhydride residue. The diamine residue comprises a 2,2'-bis(trifluoromethyl)benzidine residue. The content ratio of the 2,3,6,7-naphthalene tetracarboxylic acid dianhydride residue is 5% by mole to 90% by mole inclusive. The content ratio of the 2,2'-bis(trifluoromethyl)benzidine residue is 50% by mole or more.
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Inventors:
NAKAYAMA HIROFUMI (JP)
Application Number:
PCT/JP2022/037866
Publication Date:
May 04, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G73/10; B32B27/34; C08L79/08
Domestic Patent References:
| WO2016148150A1 | 2016-09-22 | |||
| WO2014129464A1 | 2014-08-28 |
Foreign References:
| JPH05216039A | 1993-08-27 | |||
| JP2011141448A | 2011-07-21 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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