Title:
POLYAMIDE ACID COMPOSITION AND POLYIMIDE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/162901
Kind Code:
A1
Abstract:
Provided is a polyimide composition having a reduced dielectric constant and dielectric loss tangent while maintaining the high heat resistance and mechanical strength inherent in polyimide, the polyimide composition being useful as an electronic substrate material. A polyimide composition for an electronic substrate material, the polyimide composition containing polyimide obtained by polymerizing a diamine component that contains 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindane and an acid component that contains 3,3',4,4'-biphenyltetracarboxylic dianhydride.
Inventors:
INOUE YOUHEI (JP)
MORI HIROAKI (JP)
MORI HIROAKI (JP)
Application Number:
PCT/JP2015/002146
Publication Date:
October 29, 2015
Filing Date:
April 20, 2015
Export Citation:
Assignee:
JFE CHEMICAL CORP (JP)
International Classes:
C08G73/10; B32B27/34; C09J7/22; C09J7/25; C09J7/30
Foreign References:
| JPH08302572A | 1996-11-19 | |||
| JPH05310917A | 1993-11-22 | |||
| JPS6250374A | 1987-03-05 | |||
| US4734482A | 1988-03-29 |
Other References:
See also references of EP 3106487A4
Attorney, Agent or Firm:
KUMASAKA, Akira et al. (JP)
Akira Kumasaka (JP)
Akira Kumasaka (JP)
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