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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2010/143638
Kind Code:
A1
Abstract:
Provided is a composition of a polyamide resin containing metaxylene groups, the composition comprising a polyamide (A) constituted of diamine units including 1,3-bis(aminomethyl)cyclohexane units and dicarboxylic acid units and at least an aromatic secondary amine compound (B) or a phenolic antioxidant (D), the composition having a coefficient of oxygen permeability at 23ºC and 75% RH of 1.5 cc∙mm/m2∙day∙atm or lower. This composition hence has excellent gas-barrier properties and resistance to thermal deterioration.

Inventors:
MITADERA JUN (JP)
KUROKAWA MASASHI (JP)
Application Number:
PCT/JP2010/059719
Publication Date:
December 16, 2010
Filing Date:
June 08, 2010
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
MITADERA JUN (JP)
KUROKAWA MASASHI (JP)
International Classes:
C08L77/06; C08K5/13; C08K5/18; C08K5/20; C08K5/36; C08K5/435
Foreign References:
JP2001329169A2001-11-27
JP2007031630A2007-02-08
JPH10158461A1998-06-16
JP2007039577A2007-02-15
JPS5927948A1984-02-14
JP2000080270A2000-03-21
JP2008275155A2008-11-13
JP2009035731A2009-02-19
JPH10130497A1998-05-19
JP2001164109A2001-06-19
JP2006028327A2006-02-02
Other References:
See also references of EP 2441800A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
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