Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2010/143668
Kind Code:
A1
Abstract:
Provided is a polyamide resin composition containing an m-xylene group and exhibiting excellent gas barrier properties and thermal aging resistance. The polyamide resin composition contains (A) a polyamide comprising a dicarboxylic acid unit and a diamine unit with no less than 30 mol% of m-xylylenediamine units and (B) an aromatic secondary amine compound, and has an oxygen permeability coefficient of no more than 1cc⋅mm/m2⋅day⋅atm at 23°C and 75%RH.
Inventors:
MITADERA JUN (JP)
KUROKAWA MASASHI (JP)
KUROKAWA MASASHI (JP)
Application Number:
PCT/JP2010/059794
Publication Date:
December 16, 2010
Filing Date:
June 09, 2010
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
MITADERA JUN (JP)
KUROKAWA MASASHI (JP)
MITADERA JUN (JP)
KUROKAWA MASASHI (JP)
International Classes:
C08L77/06; C08G69/26; C08K5/18; C08K5/36; F16L11/04
Foreign References:
JP2004143447A | 2004-05-20 | |||
JP2004181629A | 2004-07-02 | |||
JP2008056766A | 2008-03-13 | |||
JPS5927948A | 1984-02-14 | |||
JP2006028327A | 2006-02-02 | |||
JP2007039577A | 2007-02-15 | |||
JPH10130497A | 1998-05-19 | |||
JP2001164109A | 2001-06-19 | |||
JP2006028327A | 2006-02-02 |
Other References:
See also references of EP 2441801A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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