Title:
RESIN COMPOSITION, CURED PRODUCT, AND CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/143667
Kind Code:
A1
Abstract:
Disclosed is a resin composition which is suppressed in warping and rebound properties after thermosetting, and provides a cured film having excellent chemical resistance, heat resistance and flame retardancy. Specifically disclosed is a resin composition containing a polyimide precursor that has a polyether structure and a compound that has a thermally crosslinkable functional group, said resin composition being characterized in that the polyimide precursor has an imidization ratio of 40-98% (inclusive).
Inventors:
SUN ENHAI (JP)
ADACHI HIROAKI (JP)
SASAKI YORO (JP)
ADACHI HIROAKI (JP)
SASAKI YORO (JP)
Application Number:
PCT/JP2010/059792
Publication Date:
December 16, 2010
Filing Date:
June 09, 2010
Export Citation:
Assignee:
ASAHI KASEI E MATERIALS CORP (JP)
SUN ENHAI (JP)
ADACHI HIROAKI (JP)
SASAKI YORO (JP)
SUN ENHAI (JP)
ADACHI HIROAKI (JP)
SASAKI YORO (JP)
International Classes:
C08L79/08; C08G73/10; C08K5/29; C08K5/3492; C08K5/357; H05K3/28
Domestic Patent References:
| WO2006118105A1 | 2006-11-09 |
Foreign References:
| JP2006022302A | 2006-01-26 | |||
| JP2005120176A | 2005-05-12 | |||
| JP2007119507A | 2007-05-17 | |||
| JP2008231420A | 2008-10-02 | |||
| JPH05262875A | 1993-10-12 |
Attorney, Agent or Firm:
AOKI, Hiroyoshi et al. (JP)
Hiroyoshi Aoki (JP)
Hiroyoshi Aoki (JP)
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