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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/157606
Kind Code:
A1
Abstract:
The present invention provides a polyamide resin composition which has high fluidity, while forming a molded article that exhibits excellent gas barrier properties. A polyamide resin composition which contains a polyamide resin (A) and an impact resistance material (B), wherein: the polyamide resin (A) contains an aliphatic homopolyamide resin (A-1) and an aliphatic copolymerized polyamide resin (A-2); and the relative viscosity of the aliphatic homopolyamide resin (A-1) is from 2.10 to 2.80 and the relative viscosity of the aliphatic copolymerized polyamide resin (A-2) is from 2.90 to 3.80 as determined at 25°C by dissolving 1 g of the polyamide resin into 100 ml of 96% sulfuric acid in accordance with JIS K 6920.

Inventors:
ITO TORU (JP)
HORIIKE YUMA (JP)
Application Number:
PCT/JP2021/003890
Publication Date:
August 12, 2021
Filing Date:
February 03, 2021
Export Citation:
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Assignee:
UBE INDUSTRIES (JP)
International Classes:
C08K5/13; C08K3/16; C08K5/524; C08L77/02; C08L77/06
Domestic Patent References:
WO2008075699A12008-06-26
Foreign References:
JP2003105095A2003-04-09
JPH06299068A1994-10-25
JP2009120773A2009-06-04
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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