Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/157605
Kind Code:
A1
Abstract:
The present invention provides a polyamide resin composition which has a low hydrogen gas permeability coefficient when in the form of a molded article and has a favorable nominal tensile strain at break at a low temperature (-40°C). The polyamide resin composition contains a polyamide resin (A), a shock resistant material (B) and an inorganic compound (C), wherein: the polyamide resin (A) contains an aliphatic homopolyamide resin (A-1) and an aliphatic copolyamide resin (A-2).; and the content of the inorganic compound (C) is 1.60-3.00 parts by weight relative to 100 parts by weight of the shock resistant material (B).
Inventors:
ITO TORU (JP)
FUKUI YASUHARU (JP)
FUKUI YASUHARU (JP)
Application Number:
PCT/JP2021/003889
Publication Date:
August 12, 2021
Filing Date:
February 03, 2021
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
International Classes:
C08L77/00; C08K3/013; C08K3/16; C08K3/34
Domestic Patent References:
| WO2007046541A1 | 2007-04-26 | |||
| WO2017135215A1 | 2017-08-10 | |||
| WO2017135215A1 | 2017-08-10 |
Foreign References:
| JP2008069190A | 2008-03-27 | |||
| JP2013532748A | 2013-08-19 | |||
| JP2009191871A | 2009-08-27 |
Other References:
See also references of EP 4101896A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Download PDF:
Previous Patent: TISSUE INSPECTION DEVICE AND TISSUE INSPECTION METHOD
Next Patent: POLYAMIDE RESIN COMPOSITION
Next Patent: POLYAMIDE RESIN COMPOSITION