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Title:
POLYESTER-BASED RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDING USING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/133352
Kind Code:
A1
Abstract:
A polyester-based resin composition comprising 0.005-0.1 mass parts of a specific epoxy functional polymer (C) per 100 mass parts of a resin component containing: 80-98 mass% of a polyester resin (A) having aromatic dicarboxylic acid units and diol units; and 2-20 mass% of a polyamide resin (B) having diamine units that include 70 mol% or more meta-xylylenediamine units, and dicarboxylic acid units that include 70 mol% or more α,ω-aliphatic dicarboxylic acid units.

Inventors:
MIYABE TAKANORI (JP)
KATO TOMONORI (JP)
MITADERA JUN (JP)
Application Number:
PCT/JP2013/056230
Publication Date:
September 12, 2013
Filing Date:
March 07, 2013
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L67/02; B65D1/00; C08F212/06; C08F220/32; C08L25/14; C08L77/06
Foreign References:
JPH055058A1993-01-14
JPH04239056A1992-08-26
JP2010235804A2010-10-21
JPS62187761A1987-08-17
JPH05214244A1993-08-24
JP2011037989A2011-02-24
JPH05214223A1993-08-24
JP2006206921A2006-08-10
JP2002128999A2002-05-09
JP2002161199A2002-06-04
JPH093308A1997-01-07
JPS58160344A1983-09-22
JPH03130125A1991-06-03
JPS5890033A1983-05-28
JPH08183092A1996-07-16
JP2011037989A2011-02-24
JP2011132394A2011-07-07
Other References:
See also references of EP 2824145A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
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Claims:



 
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